Contract service

DARBOND

The DP Series is a product line of encapsulants and adhesives developed by DARBOND TECHNOLOGY for IC packaging applications such as QFN, BGA, and CSP. These materials are engineered to reduce internal stress during molding and curing, ensuring strong adhesion to silicon and lead frames. With high thermal and dielectric performance, they support higher production yield and long-term reliability in semiconductor assembly processes.

■ Features
‐ Low-stress formulation prevents package cracking or damage
‐ Heat resistance exceeding 150°C for reflow compatibility
‐ Excellent adhesion to both silicon and lead frames
‐ Low outgassing properties for cleanroom applications
‐ Options available with thermal conductivity for thermal management

■ Applications
‐ Encapsulation for QFN, BGA, and CSP packages
‐ Chip protection and structural sealing
‐ Underfill for flip-chip packaging
‐ EMI shielding applications

■ Target Industries
‐ Semiconductor packaging and assembly
‐ Automotive electronics (e.g., ECUs, power modules)
‐ Communication device PCB manufacturing
‐ Consumer electronics such as smartphones and laptops

The DP Series ensures stable IC encapsulation, improved process yields, and reliable long-term performance for advanced packaging applications.

■ Please download the product PDF or contact us for further details.