We are capable of bonding different materials such as lenses and SUS, glass cells and SUS, and quartz glass.
We offer consistent manufacturing from implementation to packaging.
We have the technical expertise to design our own bonding and sealing equipment (hardware and software).
With our customized sealing equipment, we can accommodate a wide range of product sizes, up to □20mm.
We can also control the internal pressure according to specific requirements.

◆ Example Applications
✓Physical Sensors: Size: □15mm × 3mmT
✓Optical Sensors: Size: □10mm × 2mmT
✓Pressure Sensors: Size: Several mm × 0.8mmT
✓Other Implementations: Wire bonding, die bonding, etc.

✓Glass to metal
✓Ceramics to metal
✓Alumina to metal
✓Si to metal
✓Metal to metal

◆ Technology
・Strong bonding achieved through metal fusion by heat treatment
・Gapless sealing achieved through uniform fusion
・Strong bonding achieved through stable dissolution
・Achieving uniform metal fusion through processing at high temperature and high vacuum
・Using metals for high chemical resistance, suitable for bonding in medical devices
・Using plating to specify the bonding area and achieve high bonding accuracy

◆ Features
・Good dimensional accuracy
・No clearance requirement
・Multiple simultaneous processing regardless of directionality
・Resistant to thermal degradation
・Strong chemical resistance and water resistance (e.g., sodium hypochlorite)
・Capable of maintaining high vacuum air-tightness

★ Other MEMS technical / product page
Microfabrication (pre-process) - Consistent support from prototyping to mass production
https://en.nc-net.or.jp/company/101834/product/detail/222871/

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*For inquiries, please contact
Ms. Kobayashi
Email: kobayashinon@citizen.co.jp

company : Citizen Fine Device Co., Ltd.
location : Miyota, Nagano Prefecture

For inquiries through the contact form on our website, please kindly include "Inquiry from Emidas" in the additional notes.