We can provide integrated services from chip to package!

Our strengths in encapsulation technology
We have know-how of encapsulation technology.
We have experience in SMD type crystal devices.
We have mass production facilities for initial technical verification.
We have our own equipment for mounting devices.

◆Applications and Examples of Achievements
MEMS sensor
Optical sensor MEMS mirror
Inertial sensors
Infrared sensor

★related page
・Encapsulation Bonding Technology (Post-process) - Consistent manufacturing from implementation to packaging possible
https://en.nc-net.or.jp/company/101834/product/detail/200409/
・MEMS foundry
https://en.nc-net.or.jp/company/101834/product/detail/200682/