We are able to provide a full range of services in MEMS-based manufacturing, from design and simulation to prototyping.

MEMS that form ultra-compact, high-precision, and highly functional 3D structures by making full use of semiconductor microfabrication technology.

Example: We have experience in TSV (Through Silicon Via: Through Silicon Via), rewiring technology, and micro flow paths.
Applicable to various substrates such as Si, ceramic, etc.
Since MEMS can integrate multiple functions, we will continue to enhance our technology to create products with even higher added value in the future.