Elemental Technology
Machining conditions
(wire feed rate, cutting speed, etc.)
Free abrasive liquid conditions
(abrasive number, type of processing fluid, etc.)
Wire conditions
(wire diameter, tension, etc.)

The wire saw cutting technology is extremely thin, with a wire diameter of 0.1 to 0.2 mm, which means that there is very little allowance for shaving, resulting in high productivity and efficiency.
Dicing saw cutting technology is used as a chip cutting method from brittle material wafers, and supports mass production with a curve width of 100 μm or less, high-precision positioning, and high-speed, high-precision dicing.

[Indication of the actual production location].
Processed materials: Quartz, glass, ceramics, various crystalline materials, etc.
Maximum cutting work size: w240mm x h150mm x d270mm
Minimum cutting thickness: 0.07mm~.
Example of crystal processing accuracy (wafer size: 20mm): Thickness accuracy (s/wafer) 0.003mm
　　　　　　　　　　　　　　　　　　　　　　　　　　　Angular accuracy (s/batch): 12″.