- Telephone number: +81-267-31-1133
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Machining ◆Grinding Thin lapping on both sides ・High precision (reduced thickness variation)
Industry
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Specifications
- Materials： ---
- Lots： ---
- Precision： ---
Conventional technologies/differences from other companies
Lapping process
Wafer is simultaneously lapped on both sides between the upper and lower surface plates to achieve high removal efficiency and processing accuracy. For extremely small parts that cannot be handled by double-sided lapping, a single-sided lapping process can be used for high-precision processing by bonding the wafer to a jig.
Equipment
Double-sided lapping and polishing machine
Single-sided lapping and polishing machine
Company info
| Company name | CITIZEN FINEDEVICE CO.,LTD. | EMIDAS Member Number | 101834 |
|---|---|---|---|
| Country | Japan | Street address |
Miyota-machi, Kitasaku-gun Nagano Japan |
| Telephone number | +81-267-31-1133 | Fax number | |
| Employees | 1,753,120,000 JPY | Annual sales | |
| Employees | 940 | Person in charge | Nonoka Kobayashi |
| Type of manufacturing | Office automation equipment / Electronic parts / Medical equipment | ||
