We design and propose processes tailored to meet your needs and provide comprehensive support from prototyping to mass production.

Our semiconductor process capabilities are extensive, allowing us to handle substrates with gold (Au) plating, polyimide, and other materials without concerns about contamination. Additionally, with over 20 years of experience in MEMS manufacturing, we can process various substrates such as quartz, silicon (Si), and ceramics.

◆ Features
✓Design and proposal of processes tailored to meet your needs
✓Wafer sizes up to 6 inches
✓Photolithography...
✓Thin film deposition...
✓Dry etching...
✓Wet etching...
✓Tapered etching at 60°, 90°
and more We can achieve challenging shapes and high precision in mechanical processing.

We offer contract manufacturing services for MEMS mirrors, various sensors, optical communication boards, silicon photonics, and more. Our products are adopted in communication, medical, factory automation (FA) equipment, and automotive applications.

★ Other MEMS technical / product page
Encapsulation Bonding Technology (Post-process) - Consistent manufacturing from implementation to packaging possible (Dissimilar Material Bonding)
https://en.nc-net.or.jp/company/101834/product/detail/200409/

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*For inquiries, please contact
Ms. Kobayashi
Email: kobayashinon@citizen.co.jp

company : Citizen Fine Device Co., Ltd.
location : Miyota, Nagano Prefecture

For inquiries through the contact form on our website, please kindly include "Inquiry from Emidas" in the additional notes.