The other

MEMS

◎ Consistent production support available!
[From small-scale product prototyping to mass production! Design, molding, bonding, and inspection of microfluidic devices]

◆ Technology
・Bonding and sealing: Bonding and sealing of dissimilar materials
Example) Sealing of ceramic packages and glass slides using AuSn bonding
・Fine processing: High-precision processing achieved through photolithography technology
Example) Processing of silicon molds, etc.

◆ Features
・Functional thin films
・One-stop support from wafer processing to implementation

◆ Other features
・Bonding of dissimilar materials: We offer sealing (airtight sealing, vacuum sealing, N2 sealing) implemented in high vacuum using various variations.
・MEMS fixtures: We offer fixtures with high precision, rigidity, flatness, and aspect ratio.
・Microfluidics: We provide consistent support from design and molding to bonding and inspection.
・Microplates: We propose various substrates, anchor functions, and shapes according to the application.
・Chemical-free superhydrophobic treatment processing.