Measuring equipment and testing machine

Rhesca

High Performance Bonding Model : PTR-1101
• Available for pull, push, peel and shear tester for wire bonding, TCP(TAB), GCA, Flip Chip, SMT substrate and PCB
• Touch-up function (Japanese patent 1682513) for shear test, which measurement can start from a designated height over a sample board
• Indirect, not direct, bonding through low melting-point solder for probe-heating BGA pull test
• Independent function of the main unit such as condition setting, display of measured results, and print output(option)
• Simultaneous and efficient display of up to four data-analysis windows

Solder ability Tester Model : 5200T
• Robust solderability platform is renowned for its superior build quality and exceptional performance
• Design to integrate with widest range of method of solderability tester
• PC Based analysis of wetting time, wetting force, wetting angle and surface tension.
• Compliant with national and international standards.