Measuring equipment and testing machine

TOHO

We provide comprehensive solutions for ultra-fine wire diameter measurement, bump detection, and surface defect detection, supporting quality control with precise measurements down to 5μ and defect detection at 20μ.

Overview
Our ultra-fine wire diameter measurement device uses the interference fringe diffraction method to achieve high-precision measurements down to 5μ. It supports both single-axis and dual-axis measurements, and can simultaneously detect bumps using a scanner-based system. Additionally, our surface defect detection devices can accurately detect surface defects as small as 20μ. These devices strongly support quality control in the manufacturing process of ultra-fine wires.

Features
- High-Precision Diameter Measurement:
- Interference Fringe Diffraction Method: Ensures high-precision measurement.
- Single and Dual-Axis Measurement: Allows multi-directional measurement.
- Minimum 5μ Measurement: Accurately measures even the finest diameters.
- Bump Detection:
- Scanner Method: Simultaneously performs diameter measurement and bump detection.
- High-Sensitivity Sensors: Detects even small bumps without missing them.
- Surface Defect Detection:
- Minimum 20μ Detection: Accurately detects even the smallest surface defects.
- High Resolution: Enables high-precision defect analysis.
- Real-Time Detection: Allows immediate response on the production line.

Specifications
- Ultra-Fine Wire Diameter Measurement Device:
- Measurement Range: Supports measurements from a minimum of 5μ.
- Measurement Axes: Single-axis and dual-axis.
- Method: Interference fringe diffraction.
- Display: Easy-to-read digital display.
- Bump Detection Device:
- Detection Method: Scanner-based.
- Detection Range: Simultaneous bump detection during diameter measurement.
- Sensitivity: Uses high-sensitivity sensors.
- Surface Defect Detection Device:
- Detection Range: Supports detection from a minimum of 20μ.
- Analysis Method: High-resolution defect analysis.
- Real-Time Functionality: Real-time detection on the production line.

Applications
- Ultra-Fine Wire Manufacturing: Accurate control of diameter and surface quality.
- Electronic Component Manufacturing: Quality control in the production of high-precision components.
- Medical Device Manufacturing: Defect detection and diameter measurement for ultra-fine components.
- Research and Development: Analysis of characteristics and quality improvement of ultra-fine wires.

By measuring the diameter and detecting surface defects of ultra-fine wires, these devices help achieve high-precision quality control, improving the reliability of the manufacturing process.

For more details, please download the PDF or contact us directly.