ACCRETECH (THAILAND) CO., LTD.
Most recent update: 2025-02-18
PR message
ACCRETECH (THAILAND) CO., LTD., an affiliated company of TOKYO SEIMITSU CO., LTD., delivers Precision Measuring Instrument & semiconductor solutions, driving innovation for manufacturing excellence. Trust us for cutting-edge technology & superior quality.
The AD2000T/S is a fully automatic dicing machine designed for wafers with a maximum diameter of 200 mm. It inherits its design platform from the AD3000T-PLUS, which supports 300 mm wafers. This model features a diagonally opposite dual-spindle configuration, optimizing space efficiency while improving maintenance accessibility. Additionally, it is equipped with a high-power 1.8 kW spindle, making it suitable for cutting a wide range of materials, from electronic components to power semiconductors.
■ Features
- Space-Saving Design: The diagonally opposite dual-spindle configuration allows all operations and maintenance to be performed from the front. When multiple machines are installed in a row, the side clearance required for maintenance is minimized, enabling five AD2000T machines to fit within the same space that previously accommodated only four older models.
- Enhanced Productivity: The dual-spindle design and minimized X-axis movement help reduce cutting time. The machine supports high-speed operation with:X-axis: Up to 1,000 mm/sec,Y-axis: Up to 300 mm/sec,Z-axis: Up to 80 mm/sec
- High-Power, High-Performance Spindle: Equipped with a 1.8 kW spindle, capable of up to 60,000 RPM, the AD2000T/S supports cutting a wide variety of materials, from silicon to hard-to-cut materials. Additionally, a 2.2 kW high-torque spindle is available as an optional upgrade.
■ Specifications
- Maximum Wafer Size: Diameter 200 mm
- Spindle Power: 1.8 kW
- Maximum Spindle Speed: 60,000 RPM
- X-axis: Cutting range 260 mm, max speed 1,000 mm/sec
- Y1/Y2-axis: Cutting range 260 mm, max speed 300 mm/sec
- Voltage Requirement: Three-phase AC 200-220V ±10% (Supports other voltages with a transformer)
- Maximum Power Consumption: 6.0 kVA
■ Applications
The AD2000T/S is designed to meet the precision and speed demands of the semiconductor and electronics industries, including:
- Semiconductor Industry:Dicing silicon wafers for processors and memory chips
Dicing power semiconductor wafers, such as IGBTs and MOSFETs
- Electronics Industry:Dicing ceramic substrates for integrated circuits (ICs)
- Optoelectronics Industry:Dicing LED wafers and laser diode wafers
The AD2000T/S is a cutting-edge wafer dicing solution, tailored for the semiconductor and electronics industries. It features a high-power spindle, high-speed axis drive system, and advanced software functions to optimize productivity. Supporting a variety of materials, with optional upgrades for greater precision and ease of use, it is the ideal choice for high-efficiency wafer dicing.
The ZEISS XENOS is a Coordinate Measuring Machine (CMM) designed to deliver the highest level of precision in the industry. With a maximum length measurement error (E₀, MPE) of just 0.2+L/1000 micrometers, ZEISS XENOS is ideal for research laboratories, aerospace, and optical industries that require unparalleled measurement accuracy.
■ Features
- Silicon Carbide Ceramic Material: The machine’s primary structural components are made of silicon carbide ceramic, which offers low thermal expansion, high rigidity, and lightweight properties, enhancing stability and measurement precision.
- Virtual Central Drive System: Linear drives are used in all axes, with a dual synchronized drive system for the Y-axis developed by ZEISS. This optimally distributes driving forces based on the X-axis position, ensuring consistent and highly precise measurements across the entire measuring range.
- Zerodur® Scale: Equipped with Zerodur® scales, which have near-zero thermal expansion, minimizing temperature correction uncertainties and enhancing measurement resolution.
■ Specifications
- Measuring range (X×Y×Z): 900×1,500×700 mm
- Maximum length measurement error (E₀, MPE): 0.2+L/1000 μm (at 19.5 to 20.5°C)
- Drive system: Linear drives in all axes for high-speed and precise measurements
- Structural material: Silicon carbide ceramic for high rigidity and stability
- Sensor: Equipped with VAST gold sensor, optimized for high accuracy and repeatability
■ Applications
ZEISS XENOS is utilized across a range of industries requiring ultra-high precision, including:
- Research & Development (R&D): For high-precision measurement and analysis of complex components.
- Aerospace industry: Ensuring the dimensional accuracy of aircraft components.
- Optical equipment industry: Measuring high-precision components such as lenses and mirrors.
- Precision gauge manufacturing: Used for inspection and calibration of precision measurement instruments.
With cutting-edge technology and ultimate precision, ZEISS XENOS is the gold standard for high-accuracy quality control in industries demanding exceptional measurement reliability and precision.
| Company name | ACCRETECH (THAILAND) CO., LTD. | Website URL | https://www.accretech.com/en/ |
|---|---|---|---|
| Street address |
Bangplee Samut Prakan Kingdom of Thailand
[See map] |
Person in charge | NCネットワークタイデモアカウント |
| Telephone number | Log in to display | Fax number | Log in to display |
| Capital | 10,000,000 THB | Employees | Unregister |
| Annual sales | Unregister | EMIDAS Member Number | 105825 |
| Main 3 products |
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