PREM CO.,LTD

Vacuum Reflow: High Yield Achieved with Integrated Vacuum Module Oven 

■ Overview and Value
The vacuum reflow system from PREM CO., LTD. integrates a built-in vacuum module into the reflow oven to achieve void-free soldering in high-volume production lines. It offers improved reliability and significantly higher yield for mass production.

■ Key Specifications and Functions
By incorporating a vacuum module, this reflow oven can reduce voids by up to 99% compared to conventional processes. The system supports fully automated inline operation, enabling stable, void-free processing even in large-scale production environments.

■ Features and Differentiation
・ Built-in vacuum module efficiently removes gases during the soldering process
・ Achieves up to 99% void reduction, enhancing joint strength and thermal conductivity
・ Automated inline compatibility reduces manpower and ensures stable operation
・ Applicable to high-density circuit boards and large-area components

■ Supported Industries and Applications
Ideal for automotive electronic components, power modules, LED modules, and industrial control boards requiring high reliability and void-free soldering.

■ Why Choose Vacuum Reflow
・ Enhances long-term reliability of solder joints
・ Ensures consistent quality even in mass production environments
・ Proven void reduction performance compared to conventional ovens
・ Optimizes production costs while improving yield

■ Technical Specifications
Supports inline connection in production lines, with customizable heating profiles and vacuum durations. Standard models accommodate a wide range of board sizes.

■ Implementation Requirements
We provide pre-installation evaluations based on board specifications and production conditions, supporting optimal oven selection and profile design tailored to each customer.