Shanghai Leading Semiconductor Technology Development Co.,Ltd.
Most recent update: 2025-09-04
LSTD is a comprehensive solution supplier of precision plane processing scheme, the precision plane grinding, polishing and grinding applications. LSTD including their own laboratories, factories and technicians, can engage in the design, manufacture, polishing and polishing processing services of the open developing and non-standard polishing equipment.
PR message
Our products and technology is widely used in various semiconductor, optoelectronics, optical, precision ceramics, precision metal processing, nuclear power and other industries. Chemical Mechanical Polishing Machine. Heavy Duty Dual-Heads Chemical Mechanical Polisher. Multi-Functional Polishing Machine. Double Side& single side Lapping / Polishing Machine. Precise Wax Bonding Machine
By adding active driving function to the pressure plate or work
ring, the relative movement speed between the workpiece and
the grinding disc can be effectively controlled. This helps to
reduce the tendency of wear and deformation on the lapping
plate surface, allowing the lapping plate to maintain lapping
accuracy for a longer period of time. Additionally, the
controllability of the speed ratio between the lapping plate and
the work ring makes it more convenient to control the
workpiece profile. In some cases where flatness is extremely demanding, the
precision of the lapping process has reached its limit due to the
trajectory generated by conventional lapping actions. Further
breakthroughs are not possible. By adding the reciprocating
swinging function to the pressure plate or work ring, the
repeatability of the grinding trajectory can be further reduced,
thereby further enhancing the lapping precision.
SL-2000AC is a single side lapping machine designed and manufactured to meet the demand of heavy duty and precise lapping
of large sized parts. The main body is made of big size cast iron and the machine is using very big size main bearing, which
guaranteed the precision sustainable capacity even under very heavy load. For the reducing of operator’s working strength
and for the convenient loading and unloading of big size parts, a working ring auto switching system is applied this machine,
and the assembly of pressure plate system can be swiveled out 36 degrees for the convenient of loading and unloading of the
parts with a lifting tool
Ring working position switching system allows the operator
to operate the machine at only one position, no need to
walk around the machine to load and unload the parts.
Especially for the loading and unloading of mass quantity of
parts or heavy parts, this system will tremendously relieve
the operator’s working strength and the same time ,
increase the working efficiency. Combined with an
automatic loading and unloading system, a fully automatic
lapping system can be realized.
Rigid welded machine Frame, stabilized, more operation space
4 ways driven, upper plate, lower plate ,inner pin ring and outer pin ring individually driven
Pin designed inner ring and outer ring, for higher torque and smoother transmission, as well as easier and lower cost maintenance
a total solution for lapping and polishing, including polishing machines, consumable, OEM
reciprocating swing function of the pressure plate
Long-term and stable high-intensity polishing processing can be achieved.
Sufficient load redundancy and excellent precision retention ability
Flexible adjustment and control of pressure distribution,
which is beneficial to improving product accuracy
Ceramic plate (Carrier) adsorption function, easy loading and
unloading of ceramic plate, easy automation.
The MFP-700B is a multifunctional polishing machine developed specifically for semiconductor equipment
accessories. It is suitable for polishing flat surfaces, angled surfaces, and other irregular surfaces. With two
polishing stations, one station is dedicated to polishing irregular surfaces while the other is used for fast polishing
of flat surfaces. During the polishing of irregular surfaces, the electric spindle polishing head polishes the
workpiece according to the processing trajectory set by the system. The specially designed power head structure
ensures that the polishing head maintains axial pressure during the polishing process. For large flat surface
processing, the reciprocating swing function of the lower spindle can reduce the repetition of the polishing area
trajectory, effectively ensuring the flatness of the workpiece after polishing. The distance between the flat
polishing head and the electric spindle polishing power head is adjustable, allowing most parts to be processed
simultaneously in both stations, effectively improving the efficiency of the polishing process
fully enclosed polishing area
All polishing fluid contact area is made of acid and alkali resistant materials
Working area adopts a large-size corrosion-resistant and leak-proof tray to facilitate maintenance of the work area.
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Lap polishing（ Surface treatment / Lap polishing ） |
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| Company name | Shanghai Leading Semiconductor Technology Development Co.,Ltd. | Website URL | https://www.lstd-cn.com |
|---|---|---|---|
| Street address |
Shanghai Shanghai People's Republic of China
[See map] |
Person in charge | Alice Wang |
| Telephone number | +86-13764903513 | Fax number | |
| Capital | 47,500,000 RMB | Employees | 95 |
| Annual sales | 70,000,000 JPY | EMIDAS Member Number | 106542 |
| Type of manufacturing | Heavy electric machinery / Jigs and tools / Machine tools | ||
| Main 3 products |
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| Large | Medium | Small |
|---|---|---|
| Development and production of prototype/Small-scale production | Machining | Machining/Handles small-scale production (order from 1 piece) Stainless steel Aluminum alloy Diamond |
| Surface treatment | Polishing/Lapping | Electropolishing Chemical polishing Tool polishing Mirror polishing |
| Surface treatment | Lap polishing | Lap polishing Lap mirror polishing Single-face lapping and polishing Dual-face lapping and polishing |
