The MFP-700B is a multifunctional polishing machine developed specifically for semiconductor equipment
accessories. It is suitable for polishing flat surfaces, angled surfaces, and other irregular surfaces. With two
polishing stations, one station is dedicated to polishing irregular surfaces while the other is used for fast polishing
of flat surfaces. During the polishing of irregular surfaces, the electric spindle polishing head polishes the
workpiece according to the processing trajectory set by the system. The specially designed power head structure
ensures that the polishing head maintains axial pressure during the polishing process. For large flat surface
processing, the reciprocating swing function of the lower spindle can reduce the repetition of the polishing area
trajectory, effectively ensuring the flatness of the workpiece after polishing. The distance between the flat
polishing head and the electric spindle polishing power head is adjustable, allowing most parts to be processed
simultaneously in both stations, effectively improving the efficiency of the polishing process