- Telephone number: +81-22-777-1351
- FAX: +81-22-777-1357
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Tin Platting to Microscopic True Spheres (φ８０μm a Copper Ball). [Surface Implement On Semiconductors, BGA, CSP]
![Tin Platting to Microscopic True Spheres (φ８０μm a Copper Ball). [Surface Implement On Semiconductors, BGA, CSP]](/up/library/49256/9750/55d68d85e4d78f2c7e1085394be74d66b61269c1.jpg)
Industry
IT/Mobile phone
Electronic parts
Semiconductor
Specifications
- Materials：Copper
- Lots： ---
- Precision：1/1,000 mm or less
Conventional technologies/differences from other companies
Contributed to increase implementation preciousness on semiconductors.
Electrolysis tin plating on φ８０μm a Copper Ball.
◆Characteristics
1. Securing clearness.
It is possible to obtain even gap on chip and circuit board.
2. Reduced thermal stress
Copper will not melt during reflow process.
3. increased heat dissipation
Because copper has high heat dissipation, it restraints heat storing.
◆Uses
Surface Implement On Semiconductors, BGA, CSP
Company info
| Company name | KEDICA CO.,LTD. | EMIDAS Member Number | 49256 |
|---|---|---|---|
| Country | Japan | Street address |
Sendai Izumi Miyagi Japan |
| Telephone number | +81-22-777-1351 | Fax number | +81-22-777-1357 |
| Employees | 98,000,000 JPY | Annual sales | |
| Employees | 151 | Person in charge | Atsushi Uchimi |
| Type of manufacturing | Industrial machinery / Telecommunication equipment / Electronic parts | ||
| Primary clients |
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