Environmental Regulatory Compliant Lead-Frame Outer Layer Plating

◆Characteristics
In order to comply with RoHS and other environmental restrictions, and to use as an alternative of IC Lead-frame Sn-Pb solder outer plating, we can mass-produce products with Sn plating/Sn-Bi plating.

・High reliability and achievements since 1982 on lead frame outer layer plating.
・Can analyze amount of RoHS restricted substance amount using ICP emission spectrophotometric analyzers.
・reduced process by in-line deflash (removing mold resin within the line).
・Just-in-time manufacturing with 365 days, 24 hours.
・Guarantee quality with SPC (Statistical Process Control)

Please contact us for details of plating evaluation results.

◆Uses
Semiconductor lead frames: 42 alloy (steel – nickel alloy), copper alloy.