IT/Mobile phone
Telecommunication equipment
Electronic parts
Through-hole Filling Copper Plating
◆Characteristics
This plating fills a through-hole located at the core layer of circuit board with copper.
Unlike ordinary conductive paste filling, this method will increase the circuit connection reliability by filling the hole precisely with copper. In addition, due to filing pure copper, the plating will increase heat dissipation and volume resistivity.
◆Uses
A variety of electronic parts.
Company name | KEDICA CO.,LTD. | EMIDAS Member Number | 49256 |
---|---|---|---|
Country | Japan | Street address |
Sendai Izumi Miyagi Japan |
Telephone number | +81-22-777-1351 | Fax number | +81-22-777-1357 |
Employees | 98,000,000 JPY | Annual sales | |
Employees | 151 | Person in charge | Atsushi Uchimi |
Type of manufacturing | Industrial machinery / Telecommunication equipment / Electronic parts | ||
Primary clients |
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