Outline of products
We maintain the conductance and sliding by ensuring the necessary thickness of gold plating on the inner surface.

Features
・A special cutting method that controls burrs and deformation.
・We can gold plate the inner surface up to a thickness of 10 μm.
・Cracks are controlled by adjusting the hardness.
・Inner diameter is maximized with thin walls.

Purpose
・Semiconductor inspection contact probes
・Nozzles for medical devices and dispensers, etc.
・Fiber optic communication field (fine connectors)

Standard products
IDΦ0.2～0.3×ODΦ0.23～0.4×L3～10mm