Automobile (trial production)
Semiconductor
This part is a mold used for plastic molding at semiconductor production sites.
Since these parts are subject to frequent wear, they are vacuum hardened to DC53 to increase wear resistance. Surface roughness is improved to prevent resin from sticking to the mold during molding. Mirror finish with a surface finish of Rz=0.2 is applied in the lapping process with a surface finish of Rz=1.6.
Company name | Ohno Seiko Co.,Ltd. | EMIDAS Member Number | 80724 |
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Country | Japan | Street address |
Nishio-shi Aichi Japan |
Telephone number | +81-563-75-3922 | Fax number | +81-563-75-3933 |
Employees | 15,000,000 JPY | Annual sales | |
Employees | 230 | Person in charge | Hanai Masato |
Type of manufacturing | Jigs and tools / Machine tools / Industrial machinery |