High-quality package marker for lead frames and substrates.

<In-house developed image processing software.>
✓　Conducts image positioning, mark inspection, orientation inspection, and bottom plate presence inspection for substrates and lead frames.
✓　Achieves total marking accuracy of ±0.1 mm or less.
✓　The operation display screen contains only one touch panel.
✓　Achieves user-friendly, low-stress operation.