Qualitative characteristics:
Abrasive resistance, grindability, slippery prevention, surface hardness through fixing of abrasive grains

Suitable applications:
Processing tools (e.g. for processing silicon wafers, sapphire, optical lens, quartz, drilling holes in compound materials & grooving), medical equipment, robot parts and printing machines

Production line:
Electrodeposition equipment (Using diamonds, CBN, GC and various other abrasive grains)

Maximum size for processing:
Diameter: 350mm; height: 250mm

No. of units: 10

Tools for processing brittle materials like sapphires, rubies, quartz, glass, ceramics (alumina, silicon carbide, silicon nitride, zirconia, etc.) and artificial diamonds