Electroplating of abrasive grains to every kind of surface, e.g. micro tools

・enables electroplating of ultra small diamond particles (0.2μm)
・uniform deposition even on extreme thin workpieces e.g. Ø0.02-2mm
・allows both single-layer and multilayer electrodeposition
・plating of cemented carbide and SUS materials with high adhesion strength
・possible diamond grit sizes from #18 to #100,000
・creates layers with uniform thickness even for items with a complex shape