■ Inspection and measurement equipment that offers cutting-edge technology and stable quality
This inspection and measurement equipment was developed by combining optical sensing and image processing technologies, which have been cultivated over many years, with advanced control technology. Its proprietary 3D measurement technology and high-speed, high-resolution image inspection technology have received high praise in the precise inspection fields of semiconductor device manufacturing and various electronic components.

・No. 1 market share in Japan for IC final external inspection equipment (particularly with a strong track record in automotive IC inspections)
・Currently focused on developing external inspection equipment for power devices, communication chips, and ceramic substrate inspection equipment