Sao Mai's automatic bond inspection machine is used to check and detect errors and defects on circuit boards, defects in size as well as component placement. The machine is one of the tools to ensure that the product leaving the production line fully meets the standards of appearance, without any defects during production or assembly. This is a versatile machine that can work on any device that requires precise visual inspection. The AOI will identify assembly errors with the camera and image processing software: solder short circuits, lost or disconnected components.…and analyze the images to detect visual defects in time. time, minimizing the appearance of errors in the production process.