Ultra-High Thermal Conductivity Ceramic PCB — Approximately 7 Times Higher Than Alumina PCBs
Aluminum Nitride (AlN) PCBs provide exceptional heat dissipation, making them ideal for applications requiring efficient cooling of high-power electronic components. With a thermal conductivity approximately seven times greater than that of alumina PCBs, AlN is an excellent solution for demanding thermal management applications.
Resistor patterns can be screen-printed in virtually any configuration, enabling the PCB to serve not only as a circuit board but also as a high-temperature heater PCB.
Unlike alumina PCBs, AlN allows the fabrication of long heater PCBs that are less susceptible to cracking caused by thermal expansion, making them suitable for large-area heating applications.

Key Features
• High heat resistance (operating temperatures above 300°C)
• Ultra-high thermal conductivity (170 W/m·K)
• Low coefficient of thermal expansion (4.6 × 10⁻⁶ /K)
• Excellent chemical and solvent resistance
• High design flexibility, including three-dimensional PCB configurations
• Inorganic material with excellent long-term stability