<<Materials>>
Ceramics: silicon nitride, silicon carbide, alumina, zirconia, silicon-sapphire, etc.
Metal: various alloys such as titanium, aluminum, molybdenum, tungsten, nickel, iron, copper, stainless steel, Carbide, etc
Resin: various engineering plastics, etc

We also work on processing new materials.
*In addition to processing delivered materials to be processed, we also procure materials and partial process on base materials.

<<Precision (only for single-sided lapping)>>

Flatness：0.1μ
Roughness（Ra)：0.001μ（1 nano meter）
Parallelism：1μ
Thickness difference：±0.5μ
Workable area：φ1500mm（Max workable area）


<<Precision (only for double-sided lapping)>>

Flatness：0.1μ
Roughness（Ra)：主にGCなどの梨地面
Parallelism：0.5μ
Thickness difference：±0.5μ
Workable area：φ250mm（Max workable area）

<<Equipments>>
Single-sided lap board/mirror processer: 12 in ~ 63 in (Supportable size ～φ８００㎜) 85 machines.
Double-sided lap board: 5B ~ 15B (supportable size: ～φ２５０㎜) 15 machines.