Traditionally, plating on stainless steel (SUS) requires an intermediate nickel underlayer to ensure proper adhesion. However, nickel poses significant risks of skin irritation and metal allergies, making it unsuitable for medical, wearable, and high-precision applications. Furthermore, attempting direct plating without an underlayer usually leads to poor adhesion and peeling due to the passive oxide film on stainless steel substrates.

Our Competitive Advantages & Key Differentiators:

・Mitsuya’s proprietary direct plating technology completely eliminates the need for a nickel underlayer, enabling direct gold, silver, and tin plating directly onto stainless steel components.

・100% Nickel-Free Safety: Ideal for medical devices, wearable electronics, and luxury goods where allergy-free safety and high biocompatibility are essential.

・Streamlined Process & Cost Reduction: Skipping intermediate underlayer steps shortens manufacturing lead times, reduces processing costs, and improves overall yield.

・Superior Adhesion & High Functionality: Our specialized pre-treatment overcomes passive oxide layers to achieve exceptional direct adhesion, ensuring maximum conductivity, corrosion resistance, and wear durability.

・Flexible Processing Methods: We offer flexible processing solutions, including both rack and hoop (reel-to-reel) methods, tailored for micro-springs, complex components, and continuous materials.