Tin plating is widely used in electronic components due to its excellent solderability. However, conventional tin plating is highly prone to "tin whiskers"—microscopic, needle-like crystals that grow on the plated surface and cause critical electrical short circuits. Furthermore, modern terminal designs increasingly demand dual functionality (e.g., both press-fit areas and soldering areas) on a single component. Traditional uniform-thickness plating methods struggle to fulfill these dual requirements without causing manufacturing issues, such as tin debris clogging dies during post-bending processes.

Our Competitive Advantages & Key Differentiators:

・Mitsuya resolves these challenges by integrating advanced thermal reflow treatment with highly customizable differential plating techniques.

・Whisker Growth Suppression: By applying a post-plating reflow treatment, we melt and recrystallize the tin layer, effectively preventing tin whisker formation and significantly increasing component reliability in critical electronics.

・Differential Thickness Plating for Dual-Purpose Terminals: We can precisely vary plating thickness across the same terminal—applying a thin tin layer (e.g., 0.5 µm) to the press-fit section and a thicker layer (e.g., 2.0 µm) to the soldering area.

・Tooling Protection via Selective Layer Exposure: To prevent tin buildup on stamping dies during post-forming or bending operations, we can selectively expose the underlying nickel plating in specific bend areas, ensuring smooth manufacturing and long tool life.